Input Device Securing Techniques

ABSTRACT

Input device adhesive techniques are described. A pressure sensitive key includes a sensor substrate having one or more conductors, a spacer layer, and a flexible contact layer. The spacer layer is disposed proximal to the sensor substrate and has at least one opening. The flexible contact layer is spaced apart from the sensor substrate by the spacer layer and configured to flex through the opening in response to an applied pressure to initiate an input. The flexible contact layer is secured to the spacer layer such that at first edge, the flexible contact layer is secured to the spacer layer at an approximate midpoint of the first edge and is not secured to the spacer along another portion of the first edge and at a second edge, the flexible contact layer is not secured to the spacer layer along an approximate midpoint of the second edge.

RELATED APPLICATIONS

This application claims priority under 35 U.S.C. §119(e) to thefollowing U.S. Provisional Patent Applications, the entire disclosuresof each of these applications being incorporated by reference in theirentirety:

U.S. Provisional Patent Application No. 61/606,321, filed Mar. 2, 2012,Attorney Docket Number 336082.01, and titled “Screen Edge;”

U.S. Provisional Patent Application No. 61/606,301, filed Mar. 2, 2012,Attorney Docket Number 336083.01, and titled “Input DeviceFunctionality;”

U.S. Provisional Patent Application No. 61/606,313, filed Mar. 2, 2012,Attorney Docket Number 336084.01, and titled “Functional Hinge;”

U.S. Provisional Patent Application No. 61/606,333, filed Mar. 2, 2012,Attorney Docket Number 336086.01, and titled “Usage and Authentication;”

U.S. Provisional Patent Application No. 61/613,745, filed Mar. 21, 2012,Attorney Docket Number 336086.02, and titled “Usage and Authentication;”

U.S. Provisional Patent Application No. 61/606,336, filed Mar. 2, 2012,Attorney Docket Number 336087.01, and titled “Kickstand and Camera;” and

U.S. Provisional Patent Application No. 61/607,451, filed Mar. 6, 2012,Attorney Docket Number 336143.01, and titled “Spanaway Provisional;”

and further this application incorporates the following applications byreference in their entirety:

U.S. patent application Ser. No. ______, filed May 14, 2012, AttorneyDocket Number 336554.01, and titled “Flexible Hinge and RemovableAttachment;”

U.S. patent application Ser. No. ______, filed May 14, 2012, AttorneyDocket Number 336564.01, and titled “Input Device Assembly.”

BACKGROUND

Mobile computing devices have been developed to increase thefunctionality that is made available to users in a mobile setting. Forexample, a user may interact with a mobile phone, tablet computer, orother mobile computing device to check email, surf the web, composetexts, interact with applications, and so on. However, traditionalmobile computing devices often employed a virtual keyboard that wasaccessed using touchscreen functionality of the device. This wasgenerally employed to maximize an amount of display area of thecomputing device.

Use of the virtual keyboard, however, could be frustrating to a userthat desired to provide a significant amount of inputs, such as to entera significant amount of text to compose a long email, document, and soforth. Thus, conventional mobile computing devices were often perceivedto have limited usefulness for such tasks, especially in comparison withease at which users could enter text using a conventional keyboard,e.g., of a conventional desktop computer. Use of the conventionalkeyboards, though, with the mobile computing device could decrease themobility of the mobile computing device and thus could make the mobilecomputing device less suited for its intended use in mobile settings.

SUMMARY

Input device securing techniques are described. In one or moreimplementations, a pressure sensitive key includes a sensor substratehaving one or more conductors, a spacer layer, and a flexible contactlayer. The spacer layer is disposed proximal to the sensor substrate andhas at least one opening that exposes the one or more conductors of thesensor substrate, the opening defining a plurality of edges of thepressure sensitive key. The flexible contact layer is spaced apart fromthe sensor substrate by the spacer layer and configured to flex throughthe opening in response to an applied pressure to contact the one ormore conductors of the sensor substrate to initiate an input. Theflexible contact layer is secured to the spacer layer such that at afirst edge, the flexible contact layer is secured to the spacer layer atan approximate midpoint of the first edge and is not secured to thespacer along another portion of the first edge and at a second edge, theflexible contact layer is not secured to the spacer layer along anapproximate midpoint of the second edge.

In one or more implementations, an input device includes a sensorsubstrate having a first set of one or more conductors of a firstpressure sensitive key and a second set of one or more conductors of asecond pressure sensitive key, a spacer layer disposed proximal to thesensor substrate and having first and second openings that expose thefirst and second sets of conductors, respectively, and a flexiblecontact layer spaced apart from the sensor substrate by the spacerlayer. The flexible contact layer is configured to flex through thefirst and second openings responsive to an applied pressure to contact,respectively, the first and second sets of conductors to initiaterespective first and second inputs. An arrangement of adhesive thatsecures the flexible contact layer to the spacer layer along one or moreedges of the first pressure sensitive key is different than anarrangement of adhesive that secures the flexible contact layer to thespacer layer along one or more edges of the second pressure sensitivekey.

In one or more implementations, an input device includes a sensorsubstrate having a plurality of sets of one or more conductors of arespective plurality of pressure sensitive keys, a spacer layer disposedproximal to the sensor substrate and having a plurality of openings thatexpose the plurality of sets of conductors, respectively, a flexiblecontact layer, and a press equalization device. The flexible contactlayer is spaced apart from the sensor substrate by the spacer layer andconfigured to flex through the plurality of openings responsive torespective applied pressures to respective sets of conductors toinitiate respective inputs. The pressure equalization device is formedas a series of connected channels that connect one or more of theplurality of openings to an outside area of the input device to permitair pressure of the outside area to generally equalize with air pressurewithin the one or more of the plurality of openings.

This Summary is provided to introduce a selection of concepts in asimplified form that are further described below in the DetailedDescription. This Summary is not intended to identify key features oressential features of the claimed subject matter, nor is it intended tobe used as an aid in determining the scope of the claimed subjectmatter.

BRIEF DESCRIPTION OF THE DRAWINGS

The detailed description is described with reference to the accompanyingfigures. In the figures, the left-most digit(s) of a reference numberidentifies the figure in which the reference number first appears. Theuse of the same reference numbers in different instances in thedescription and the figures may indicate similar or identical items.Entities represented in the figures may be indicative of one or moreentities and thus reference may be made interchangeably to single orplural forms of the entities in the discussion.

FIG. 1 is an illustration of an environment in an example implementationthat is operable to employ the techniques described herein.

FIG. 2 depicts an example implementation of an input device of FIG. 1 asshowing a flexible hinge in greater detail.

FIG. 3 depicts an example implementation showing a perspective view of aconnecting portion of FIG. 2 that includes mechanical couplingprotrusions and a plurality of communication contacts.

FIG. 4 depicts an example of a cross-sectional view of a pressuresensitive key of a keyboard of the input device of FIG. 2.

FIG. 5 depicts an example of a pressure sensitive key of FIG. 4 ashaving pressure applied at a first location of a flexible contact layerto cause contact with a corresponding first location of a sensorsubstrate.

FIG. 6 depicts an example of the pressure sensitive key of FIG. 4 ashaving pressure applied at a second location of the flexible contactlayer to cause contact with a corresponding second location of thesensor substrate.

FIG. 7 depicts a bottom view of a pressure sensitive key of FIG. 4 ashaving a flexible contact layer secured at a plurality of locationsalong edges of the key.

FIG. 8 depicts another version of FIG. 7 in which a securing portion ismoved to a different location along an edge of the key.

FIG. 9A depicts an example of an adhesive layer applied as part of akeyboard having a plurality of keys in which different arrangements ofadhesive are used for different keys.

FIG. 9B depicts another example implementation of a layer incorporatinga matric that may be used to reduce air entrapment.

FIG. 10 illustrates an example system including various components of anexample device that can be implemented as any type of computing deviceas described with reference to FIGS. 1-9 to implement embodiments of thetechniques described herein.

DETAILED DESCRIPTION

Overview

Pressure sensitive keys may be used as part of an input device tosupport a relatively thin form factor, such as approximately threemillimeters. However, pressure sensitive keys may not provide a degreeof feedback that is common with conventional mechanical keyboards andtherefore may result in missed hits and partial hits to intended keys ofthe keyboard. Further, conventional configuration of the pressuresensitive keys often resulted in different sensitivities due to theflexibility of the material being deflected, e.g., greater deflection isgenerally observed at a central area of the key as opposed to an edge ofthe key. Therefore, conventional pressure sensitive keys could result inan inconsistent user experience with a device that employs the keys.

Input device securing techniques are described. In one or moreimplementations, a pressure sensitive key is configured to provide anormalized output, e.g., to counteract differences in the flexibility atdifferent positions of the pressure sensitive key. For example,sensitivity at an edge of a key may be increased in comparison with thesensitivity at a center of the key to address the differences inflexibility of the key at those positions.

The sensitivity may be adjusted in a variety of ways. For example,sensitivity may be adjusted by arrangement of support structure and/oradhesives used to secure a flexible contact layer to a spacer layer.This may be used to alter flexibility along different locations along anedge of the key. Sensitivity may also be adjusted for different keys.For example, depending on a location on a keyboard, different keys maybe pressed using different fingers as well as different parts of afinger. Accordingly, arrangement of the adhesive may also be performedto address these differences. Further discussion of these and otherfeatures including formation and use of a pressure equalization devicemay be found in relation to the following sections.

In the following discussion, an example environment is first describedthat may employ the techniques described herein. Example procedures arethen described which may be performed in the example environment as wellas other environments. Consequently, performance of the exampleprocedures is not limited to the example environment and the exampleenvironment is not limited to performance of the example procedures.

Example Environment

FIG. 1 is an illustration of an environment 100 in an exampleimplementation that is operable to employ the techniques describedherein. The illustrated environment 100 includes an example of acomputing device 102 that is physically and communicatively coupled toan input device 104 via a flexible hinge 106. The computing device 102may be configured in a variety of ways. For example, the computingdevice 102 may be configured for mobile use, such as a mobile phone, atablet computer as illustrated, and so on. Thus, the computing device102 may range from full resource devices with substantial memory andprocessor resources to a low-resource device with limited memory and/orprocessing resources. The computing device 102 may also relate tosoftware that causes the computing device 102 to perform one or moreoperations.

The computing device 102, for instance, is illustrated as including aninput/output module 108. The input/output module 108 is representativeof functionality relating to processing of inputs and rendering outputsof the computing device 102. A variety of different inputs may beprocessed by the input/output module 108, such as inputs relating tofunctions that correspond to keys of the input device 104, keys of avirtual keyboard displayed by the display device 110 to identifygestures and cause operations to be performed that correspond to thegestures that may be recognized through the input device 104 and/ortouchscreen functionality of the display device 110, and so forth. Thus,the input/output module 108 may support a variety of different inputtechniques by recognizing and leveraging a division between types ofinputs including key presses, gestures, and so on.

In the illustrated example, the input device 104 is configured as akeyboard having a QWERTY arrangement of keys although other arrangementsof keys are also contemplated. Further, other non-conventionalconfigurations are also contemplated, such as a game controller,configuration to mimic a musical instrument, and so forth. Thus, theinput device 104 and keys incorporated by the input device 104 mayassume a variety of different configurations to support a variety ofdifferent functionality.

As previously described, the input device 104 is physically andcommunicatively coupled to the computing device 102 in this examplethrough use of a flexible hinge 106. The flexible hinge 106 is flexiblein that rotational movement supported by the hinge is achieved throughflexing (e.g., bending) of the material forming the hinge as opposed tomechanical rotation as supported by a pin, although that embodiment isalso contemplated. Further, this flexible rotation may be configured tosupport movement in one direction (e.g., vertically in the figure) yetrestrict movement in other directions, such as lateral movement of theinput device 104 in relation to the computing device 102. This may beused to support consistent alignment of the input device 104 in relationto the computing device 102, such as to align sensors used to changepower states, application states, and so on.

The flexible hinge 106, for instance, may be formed using one or morelayers of fabric and include conductors formed as flexible traces tocommunicatively couple the input device 104 to the computing device 102and vice versa. This communication, for instance, may be used tocommunicate a result of a key press to the computing device 102, receivepower from the computing device, perform authentication, providesupplemental power to the computing device 102, and so on. The flexiblehinge 106 may be configured in a variety of ways, further discussion ofwhich may be found in relation to the following figure.

FIG. 2 depicts an example implementation 200 of the input device 104 ofFIG. 1 as showing the flexible hinge 106 in greater detail. In thisexample, a connection portion 202 of the input device is shown that isconfigured to provide a communicative and physical connection betweenthe input device 104 and the computing device 102. In this example, theconnection portion 202 has a height and cross section configured to bereceived in a channel in the housing of the computing device 102,although this arrangement may also be reversed without departing fromthe spirit and scope thereof.

The connection portion 202 is flexibly connected to a portion of theinput device 104 that includes the keys through use of the flexiblehinge 106. Thus, when the connection portion 202 is physically connectedto the computing device the combination of the connection portion 202and the flexible hinge 106 supports movement of the input device 104 inrelation to the computing device 102 that is similar to a hinge of abook.

For example, rotational movement may be supported by the flexible hinge106 such that the input device 104 may be placed against the displaydevice 110 of the computing device 102 and thereby act as a cover. Theinput device 104 may also be rotated so as to be disposed against a backof the computing device 102, e.g., against a rear housing of thecomputing device 102 that is disposed opposite the display device 110 onthe computing device 102.

Naturally, a variety of other orientations are also supported. Forinstance, the computing device 102 and input device 104 may assume anarrangement such that both are laid flat against a surface as shown inFIG. 1. In another instance, a typing arrangement may be supported inwhich the input device 104 is laid flat against a surface and thecomputing device 102 is disposed at an angle to permit viewing of thedisplay device 110, e.g., such as through use of a kickstand disposed ona rear surface of the computing device 102. Other instances are alsocontemplated, such as a tripod arrangement, meeting arrangement,presentation arrangement, and so forth.

The connecting portion 202 is illustrated in this example as includingmagnetic coupling devices 204, 206, mechanical coupling protrusions 208,210, and a plurality of communication contacts 212. The magneticcoupling devices 204, 206 are configured to magnetically couple tocomplementary magnetic coupling devices of the computing device 102through use of one or more magnets. In this way, the input device 104may be physically secured to the computing device 102 through use ofmagnetic attraction.

The connecting portion 202 also includes mechanical coupling protrusions208, 210 to form a mechanical physical connection between the inputdevice 104 and the computing device 102. The mechanical couplingprotrusions 208, 210 are shown in greater detail in the followingfigure.

FIG. 3 depicts an example implementation 300 shown a perspective view ofthe connecting portion 202 of FIG. 2 that includes the mechanicalcoupling protrusions 208, 210 and the plurality of communicationcontacts 212. As illustrated, the mechanical coupling protrusions 208,210 are configured to extend away from a surface of the connectingportion 202, which in this case is perpendicular although other anglesare also contemplated.

The mechanical coupling protrusions 208, 210 are configured to bereceived within complimentary cavities within the channel of thecomputing device 102. When so received, the mechanical couplingprotrusions 208, 210 promote a mechanical binding between the deviceswhen forces are applied that are not aligned with an axis that isdefined as correspond to the height of the protrusions and the depth ofthe cavity.

For example, when a force is applied that does coincide with thelongitudinal axis described previously that follows the height of theprotrusions and the depth of the cavities, a user overcomes the forceapplied by the magnets solely to separate the input device 104 from thecomputing device 102. However, at other angles the mechanical couplingprotrusion 208, 210 are configured to mechanically bind within thecavities, thereby creating a force to resist removal of the input device104 from the computing device 102 in addition to the magnetic force ofthe magnetic coupling devices 204, 206. In this way, the mechanicalcoupling protrusions 208, 210 may bias the removal of the input device104 from the computing device 102 to mimic tearing a page from a bookand restrict other attempts to separate the devices.

The connecting portion 202 is also illustrated as including a pluralityof communication contacts 212. The plurality of communication contacts212 is configured to contact corresponding communication contacts of thecomputing device 102 to form a communicative coupling between thedevices. The communication contacts 212 may be configured in a varietyof ways, such as through formation using a plurality of spring loadedpins that are configured to provide a consistent communication contactbetween the input device 104 and the computing device 102. Therefore,the communication contact may be configured to remain during minormovement of jostling of the devices. A variety of other examples arealso contemplated, including placement of the pins on the computingdevice 102 and contacts on the input device 104.

FIG. 4 depicts an example of a cross-sectional view of a pressuresensitive key 400 of a keyboard of the input device 104 of FIG. 2. Thepressure sensitive key 400 in this example is illustrated as beingformed using a flexible contact layer 402 (e.g., Mylar) that is spacedapart from the sensor substrate 404 using a spacer layer 406, 408, whichmay be formed as another layer of Mylar or other bendable material,formed on the sensor substrate 404, and so on. In this example, theflexible contact layer 402 does not contact the sensor substrate 404absent application of pressure against the flexible contact layer 402.

The flexible contact layer 402 in this example includes a forcesensitive ink 410 disposed on a surface of the flexible contact layer402 that is configured to contact the sensor substrate 404. The forcesensitive ink 410 is configured such that an amount of resistance of theink varies directly in relation to an amount of pressure applied. Theforce sensitive ink 410, for instance, may be configured with arelatively rough surface that is compressed against the sensor substrate404 upon an application of pressure against the flexible contact layer402. The greater the amount of pressure, the more the force sensitiveink 410 is compressed, thereby increasing conductivity and decreasingresistance of the force sensitive ink 410. Other conductors may also bedisposed on the flexible contact layer 402 without departing form thespirit and scope therefore, including other types of pressure sensitiveand non-pressure sensitive conductors.

The sensor substrate 404 includes a one or more conductors 412 disposedthereon that are configured to be contacted by the force sensitive ink410 of the flexible contact layer 402. When contacted, an analog signalmay be generated for processing by the input device 104 and/or thecomputing device 102, e.g., to recognize whether the signal is likelyintended by a user to provide an input for the computing device 102. Avariety of different types of conductors 412 may be disposed on thesensor substrate 404, such as formed from a variety of conductivematerials (e.g., silver, copper), disposed in a variety of differentconfigurations such as inter-digitated trace fingers, support use of asingle conductor, and so on.

FIG. 5 depicts an example 500 of the pressure sensitive key 400 of FIG.4 as having pressure applied at a first location of the flexible contactlayer 402 to cause contact of the force sensitive ink 410 with acorresponding first location of the sensor substrate 404. The pressureis illustrated through use of an arrow in FIG. 5 and may be applied in avariety of ways, such as by a finger of a user's hand, stylus, pen, andso on. In this example, the first location at which pressure is appliedas indicated by the arrow is located generally near a center region ofthe flexible contact layer 402 that is disposed between the spacerlayers 406, 408. Due to this location, the flexible contact layer 402may be considered generally flexible (e.g., bendable and/or stretchable)and thus responsive to the pressure.

This flexibility permits a relatively large area of the flexible contactlayer 402, and thus the force sensitive ink 410, to contact theconductors 412 of the sensor substrate 404. Thus, a relatively strongsignal may be generated. Further, because the flexibility of theflexible contact layer 402 is relatively high at this location, arelatively large amount of the force may be transferred through theflexible contact layer 402, thereby applying this pressure to the forcesensitive ink 410. As previously described, this increase in pressuremay cause a corresponding increase in conductivity of the forcesensitive ink and decrease in resistance of the ink. Thus, therelatively high amount of flexibility of the flexible contact layer atthe first location may cause a relatively stronger signal to begenerated in comparison with other locations of the flexible contactlayer 402 that located closer to an edge of the key, an example of whichis described in relation to the following figure.

FIG. 6 depicts an example 600 of the pressure sensitive key 400 of FIG.4 as having pressure applied at a second location of the flexiblecontact layer 402 to cause contact with a corresponding second locationof the sensor substrate 404. In this example, the second location ofFIG. 6 at which pressure is applied is located closer to an edge of thepressure sensitive key (e.g., closer to an edge of the spacer layer 406)than the first location of FIG. 5. Due to this location, the flexiblecontact layer 402 has reduced flexibility when compared with the firstlocation and thus less responsive to pressure.

This reduced flexibility may cause a reduction in an area of theflexible contact layer 402, and thus the force sensitive ink 410, thatcontacts the conductors 412 of the sensor substrate 404. Thus, a signalproduced at the second location may be weaker than a signal produced atthe first location of FIG. 5.

Further, because the flexibility of the flexible contact layer 402 isrelatively low at this location, a relatively low amount of the forcemay be transferred through the flexible contact layer 402, therebyreducing the amount of pressure transmitted to the force sensitive ink410. As previously described, this decrease in pressure may cause acorresponding decrease in conductivity of the force sensitive ink andincrease in resistance of the ink in comparison with the first locationof FIG. 5. Thus, the reduced flexibility of the flexible contact layer402 at the second location in comparison with the first location maycause a relatively weaker signal to be generated. Further, thissituation may be exacerbated by a partial hit in which a smaller portionof the user's finger is able to apply pressure at the second location ofFIG. 6 in comparison with the first location of FIG. 5.

However, as previously described adhesive used to secure the flexiblecontact layer 402 with the spacer layer 406 may be arranged (e.g.,patterned) to promote flexibility of the flexible contact layer 402 atdesired locations of the key, further discussion of which may be foundin relation to the following figure.

FIG. 7 depicts a top view 700 of a pressure sensitive key of FIG. 4 ashaving the flexible contact layer 402 secured at a plurality oflocations along edges of the key. First, second, third, and fourth edges702, 704, 706, 708 are illustrated in this example as defining anopening 710 of a spacer layer 406/408 of a pressure sensitive key. Theopening 710 as described in relation to FIGS. 4-6 permits the flexiblecontact layer 402 to flex (e.g., bend and/or stretch) through theopening 710 to contact the one or more conductors 412 of the sensorsubstrate 404.

In the illustrated example, a first securing portion 712 is illustratedas disposed proximal to the first edge 702 of the opening 710. Likewise,second, third, and fourth securing portions 714, 716, 718 areillustrated as disposed proximal to respective second, third, and fourthedges 704, 706, 708 of the opening 710. The securing portions may beconfigured in a variety of ways, such as through use of an adhesive,mechanical securing device (e.g., pins), and so on. Furthermore,securing portions maybe configured without adhesive and only providestructure integrity. For example, the structural support and/or adhesivemay be applied as a series of dots or other shapes to the spacer layer406 which is then contacted (e.g., pressed) to the flexible contactlayer 402.

Regardless of the technique used to secure the flexible contact layer402 to the spacer layer 406, flexibility may be configured as desired bypermitting portions of the flexible contact layer 402 along the edge ofthe opening to remain unsecured. For instance, the first and secondsecuring portions 714, 716 may define sole areas at which the flexiblecontact layer 402 is secured to the spacer layer 406 along therespective first and second edges 702, 704. Therefore, flexibility ofthe flexible contact layer 402 may decrease as a distance between apoint of contact of the pressure and a securing portion decreasessimilar to the edge discussion of FIGS. 5 and 6, such as due to slidingof the flexible contact layer over the edge, permit increasedstretching, and so forth.

However, the reverse is also true in that flexibility increases thefurther away pressure is applied from the securing portions. Thus,flexibility along the edges of the opening 710 may be increased byincluding portions along an edge at which the flexible contact layer 402is not secured (proximally) to the spacer layer 406. Thus, differentarrangements of how the flexible contact layer 402 is secured to thespacer layer 404 may be used to support different amounts of flexibilityat different locations of the flexible contact layer 402.

For example, as illustrated the first and second securing portions 712,714 are located closer together than the first and third securingportions 712, 716. Accordingly, points (e.g., a midpoint) between thefirst and third securing portions 712, 716 may have greater flexibilitythan corresponding points (e.g., a midpoint) between the first andsecond securing portions 712, 714. In this way, a designer may configurethe flexible contact surface 402 to increase or decrease flexibility atparticular locations as desired.

In the example 800 of FIG. 8, for instance, the second securing portion714 is moved from one end of the second edge 704 to an opposing end ofthe second edge 704. Thus, flexibility is increased on the left upperportion of the key in this example and decreased in the upper rightportion of the key. A variety of other examples are also contemplated,examples of which are shown in relation to a keyboard in the followingexample.

FIG. 9A depicts an example of a spacer layer 900 applied as part of akeyboard having a plurality of keys in which different arrangements ofsupport structure and/or adhesive are used for different keys. Securingportions in this example are illustrated in shaded (cross hatched) linesin regions of support structure and adhesive while the dots depict onlysupport structure regions that are used to secured the flexible contactlayer 402 with the sensor substrate 404. As shown, differentarrangements of the securing portions may be used to address differencesin how corresponding keys are likely to be pressed.

For example, as shown the arrangements of support structure forrespective keys in the home row (e.g., keys 43-55) is different thanarrangements of support structure for a row of keys in the next lowerrow, e.g., keys 56-67. This may be performed to address “where” a key islikely to be pressed, such as at a center or particular one of the foursides of the key. This may also be performed to address “how” a key alikely to be pressed, such as using a pad of a finger as opposed to auser's fingernail, which finger of a user is likely to press the key,and so on. Thus, as illustrated in the example adhesive layer 900 ofFIG. 9, different arrangements may be used for different rows of keys aswell as for different columns of the keys.

The spacer layer 900 in this example is also illustrated as formingfirst and second pressure equalization devices 902, 904. In thisexample, support structure and/or adhesive is disposed to leave channelsformed between the support structure and/or adhesive. Thus, the supportstructure and/or adhesive defines the channels that form the device. Thechannels are configured to connect openings 710 formed as part of thepressure sensitive keys between the flexible contact layer 402 and thesensor substrate 404 to an outside environment of the input device 104.

In this way, air may move between the outside environment and theopenings through the channels to generally equalize the air pressure,which may help prevent damage to the input device 104, e.g., when facedwith reduced air pressure in an airplane. In one or moreimplementations, the channels may be formed as a labyrinth having aplurality of bends to protect against outside contaminants from passingthrough the pressure equalization devices 902, 904 to the openings 710.In the illustrated example, the pressure equalization devices 902, 904are disposed as part of a palm rest of the spacer layer to leverageavailable space to form longer channels and thus further protect againstcontamination. Naturally, a wide variety of other examples and locationsare also contemplated without departing from the spirit and scopethereof.

FIG. 9B depicts another example implementation of a layer 950incorporating a matric that may be used to reduce air entrapment. Inthis example, strategic adhesive placement (or other securingtechniques) is used to reduce air entrapment between consecutive layers.In the previous example, a vented labyrinth seal in the sensorsubstrate/flexible contact layer interface was described.

In this example, a layer (e.g., below the sensor substrate 202) is notconfigured as a “full bleed adhesive sheet,” but instead is a squarematrix of adhesive patches that bind the consecutive layers together.This allows easier assembly and eliminates air entrapment betweenlayers. In this way, multiple layers may be bonded together throughadhesive construction to achieve thin profile, stiffness, and allowinternal electronics nesting of components.

Example System and Device

FIG. 10 illustrates an example system generally at 1000 that includes anexample computing device 1002 that is representative of one or morecomputing systems and/or devices that may implement the varioustechniques described herein. The computing device 1002 may be, forexample, be configured to assume a mobile configuration through use of ahousing formed and size to be grasped and carried by one or more handsof a user, illustrated examples of which include a mobile phone, mobilegame and music device, and tablet computer although other examples arealso contemplated.

The example computing device 1002 as illustrated includes a processingsystem 1004, one or more computer-readable media 1006, and one or moreI/O interface 1008 that are communicatively coupled, one to another.Although not shown, the computing device 1002 may further include asystem bus or other data and command transfer system that couples thevarious components, one to another. A system bus can include any one orcombination of different bus structures, such as a memory bus or memorycontroller, a peripheral bus, a universal serial bus, and/or a processoror local bus that utilizes any of a variety of bus architectures. Avariety of other examples are also contemplated, such as control anddata lines.

The processing system 1004 is representative of functionality to performone or more operations using hardware. Accordingly, the processingsystem 1004 is illustrated as including hardware element 1010 that maybe configured as processors, functional blocks, and so forth. This mayinclude implementation in hardware as an application specific integratedcircuit or other logic device formed using one or more semiconductors.The hardware elements 1010 are not limited by the materials from whichthey are formed or the processing mechanisms employed therein. Forexample, processors may be comprised of semiconductor(s) and/ortransistors (e.g., electronic integrated circuits (ICs)). In such acontext, processor-executable instructions may beelectronically-executable instructions.

The computer-readable storage media 1006 is illustrated as includingmemory/storage 1012. The memory/storage 1012 represents memory/storagecapacity associated with one or more computer-readable media. Thememory/storage component 1012 may include volatile media (such as randomaccess memory (RAM)) and/or nonvolatile media (such as read only memory(ROM), Flash memory, optical disks, magnetic disks, and so forth). Thememory/storage component 1012 may include fixed media (e.g., RAM, ROM, afixed hard drive, and so on) as well as removable media (e.g., Flashmemory, a removable hard drive, an optical disc, and so forth). Thecomputer-readable media 1006 may be configured in a variety of otherways as further described below.

Input/output interface(s) 1008 are representative of functionality toallow a user to enter commands and information to computing device 1002,and also allow information to be presented to the user and/or othercomponents or devices using various input/output devices. Examples ofinput devices include a keyboard, a cursor control device (e.g., amouse), a microphone, a scanner, touch functionality (e.g., capacitiveor other sensors that are configured to detect physical touch), a camera(e.g., which may employ visible or non-visible wavelengths such asinfrared frequencies to recognize movement as gestures that do notinvolve touch), and so forth. Examples of output devices include adisplay device (e.g., a monitor or projector), speakers, a printer, anetwork card, tactile-response device, and so forth. Thus, the computingdevice 1002 may be configured in a variety of ways to support userinteraction.

The computing device 1002 is further illustrated as beingcommunicatively and physically coupled to an input device 1014 that isphysically and communicatively removable from the computing device 1002.In this way, a variety of different input devices may be coupled to thecomputing device 1002 having a wide variety of configurations to supporta wide variety of functionality. In this example, the input device 1014includes one or more keys 1016, which may be configured as pressuresensitive keys, mechanically switched keys, and so forth.

The input device 1014 is further illustrated as include one or moremodules 1018 that may be configured to support a variety offunctionality. The one or more modules 1018, for instance, may beconfigured to process analog and/or digital signals received from thekeys 1016 to determine whether a keystroke was intended, determinewhether an input is indicative of resting pressure, supportauthentication of the input device 1014 for operation with the computingdevice 1002, and so on.

Various techniques may be described herein in the general context ofsoftware, hardware elements, or program modules. Generally, such modulesinclude routines, programs, objects, elements, components, datastructures, and so forth that perform particular tasks or implementparticular abstract data types. The terms “module,” “functionality,” and“component” as used herein generally represent software, firmware,hardware, or a combination thereof. The features of the techniquesdescribed herein are platform-independent, meaning that the techniquesmay be implemented on a variety of commercial computing platforms havinga variety of processors.

An implementation of the described modules and techniques may be storedon or transmitted across some form of computer-readable media. Thecomputer-readable media may include a variety of media that may beaccessed by the computing device 1002. By way of example, and notlimitation, computer-readable media may include “computer-readablestorage media” and “computer-readable signal media.”

“Computer-readable storage media” may refer to media and/or devices thatenable persistent and/or non-transitory storage of information incontrast to mere signal transmission, carrier waves, or signals per se.Thus, computer-readable storage media refers to non-signal bearingmedia. The computer-readable storage media includes hardware such asvolatile and non-volatile, removable and non-removable media and/orstorage devices implemented in a method or technology suitable forstorage of information such as computer readable instructions, datastructures, program modules, logic elements/circuits, or other data.Examples of computer-readable storage media may include, but are notlimited to, RAM, ROM, EEPROM, flash memory or other memory technology,CD-ROM, digital versatile disks (DVD) or other optical storage, harddisks, magnetic cassettes, magnetic tape, magnetic disk storage or othermagnetic storage devices, or other storage device, tangible media, orarticle of manufacture suitable to store the desired information andwhich may be accessed by a computer.

“Computer-readable signal media” may refer to a signal-bearing mediumthat is configured to transmit instructions to the hardware of thecomputing device 1002, such as via a network. Signal media typically mayembody computer readable instructions, data structures, program modules,or other data in a modulated data signal, such as carrier waves, datasignals, or other transport mechanism. Signal media also include anyinformation delivery media. The term “modulated data signal” means asignal that has one or more of its characteristics set or changed insuch a manner as to encode information in the signal. By way of example,and not limitation, communication media include wired media such as awired network or direct-wired connection, and wireless media such asacoustic, RF, infrared, and other wireless media.

As previously described, hardware elements 1010 and computer-readablemedia 1006 are representative of modules, programmable device logicand/or fixed device logic implemented in a hardware form that may beemployed in some embodiments to implement at least some aspects of thetechniques described herein, such as to perform one or moreinstructions. Hardware may include components of an integrated circuitor on-chip system, an application-specific integrated circuit (ASIC), afield-programmable gate array (FPGA), a complex programmable logicdevice (CPLD), and other implementations in silicon or other hardware.In this context, hardware may operate as a processing device thatperforms program tasks defined by instructions and/or logic embodied bythe hardware as well as a hardware utilized to store instructions forexecution, e.g., the computer-readable storage media describedpreviously.

Combinations of the foregoing may also be employed to implement varioustechniques described herein. Accordingly, software, hardware, orexecutable modules may be implemented as one or more instructions and/orlogic embodied on some form of computer-readable storage media and/or byone or more hardware elements 1010. The computing device 1002 may beconfigured to implement particular instructions and/or functionscorresponding to the software and/or hardware modules. Accordingly,implementation of a module that is executable by the computing device1002 as software may be achieved at least partially in hardware, e.g.,through use of computer-readable storage media and/or hardware elements1010 of the processing system 1004. The instructions and/or functionsmay be executable/operable by one or more articles of manufacture (forexample, one or more computing devices 1002 and/or processing systems1004) to implement techniques, modules, and examples described herein.

CONCLUSION

Although the example implementations have been described in languagespecific to structural features and/or methodological acts, it is to beunderstood that the implementations defined in the appended claims isnot necessarily limited to the specific features or acts described.Rather, the specific features and acts are disclosed as example forms ofimplementing the claimed features.

1-10. (canceled)
 11. An input device comprising: a sensor substratehaving a first set of one or more conductors of a first pressuresensitive key and a second set of one or more conductors of a secondpressure sensitive key; a spacer layer disposed proximal to the sensorsubstrate and having first and second openings that expose the first andsecond sets of conductors, respectively; and a flexible contact layerspaced apart from the sensor substrate by the spacer layer andconfigured to flex through the first and second openings responsive toan applied pressure to contact, respectively, the first and second setsof conductors to initiate respective first and second inputs, in whichan arrangement of adhesive that secures the flexible contact layer tothe spacer layer along one or more edges of the first pressure sensitivekey is different than an arrangement of adhesive that secures theflexible contact layer to the spacer layer along one or more edges ofthe second pressure sensitive key.
 12. An input device as described inclaim 11, wherein the arrangements define portions along the edges ofthe first and second pressure sensitive keys, respectively, that do notinclude adhesive thereby permitting greater flexibility of the flexiblecontact layer to contact the sensor substrate at a location disposedproximal the portion of the edge that does not include the adhesive incomparison with a portion of the edge that does include the adhesive.13. An input device as described in claim 11, wherein the first pressuresensitive key is configured for inclusion as part of a home row of akeyboard and the second pressure sensitive key is not included as partof the home row of the keyboard.
 14. An input device as described inclaim 11, wherein the arrangements are configured to address alikelihood of missed hits of the respective first and second pressuresensitive keys. 15-20. (canceled)
 21. An input device comprising: asensor substrate having a first set of one or more conductors of a firstpressure sensitive key and a second set of one or more conductors of asecond pressure sensitive key; a spacer layer disposed proximal to thesensor substrate and having first and second openings that expose thefirst and second sets of conductors, respectively; and a flexiblecontact layer spaced apart from the sensor substrate by the spacer layerand configured to flex through the first and second openings responsiveto an applied pressure to contact, respectively, the first and secondsets of conductors to initiate respective first and second inputs usinga force sensitive ink, in which an arrangement of adhesive that securesthe flexible contact layer to the spacer layer along one or more edgesof the first pressure sensitive key is different than an arrangement ofadhesive that secures the flexible contact layer to the spacer layeralong one or more edges of the second pressure sensitive key.
 22. Aninput device as described in claim 21, wherein the arrangements defineportions along the edges of the first and second pressure sensitivekeys, respectively, that do not include adhesive thereby permittinggreater flexibility of the flexible contact layer to contact the sensorsubstrate at a location disposed proximal the portion of the edge thatdoes not include the adhesive in comparison with a portion of the edgethat does include the adhesive.
 23. An input device as described inclaim 21, wherein the first pressure sensitive key is configured forinclusion as part of a home row of a keyboard and the second pressuresensitive key is not included as part of the home row of the keyboard.24. An input device as described in claim 21, wherein the arrangementsare configured to address a likelihood of missed hits of the respectivefirst and second pressure sensitive keys.
 25. An input device asdescribed in claim 21, wherein an amount of pressure applied theflexible contact layer that is usable to initiate an input for the firstpressure sensitive key is different than an amount of pressure appliedto the flexible contact layer that is usable to initiate an input forthe second pressure sensitive key.
 26. An input device as described inclaim 21, wherein flexibility of the flexible contact layer for thefirst pressure sensitive key is different than flexibility of theflexible contact layer for the second pressure sensitive key.
 27. Aninput device as described in claim 21, wherein flexibility of theflexible contact layer along edges of the first pressure sensitive keyor the second pressure sensitive key is different, one to another, forthe first pressure sensitive key or the second pressure sensitive key.28. An input device comprising: a sensor substrate having a plurality ofconductors that support a plurality of pressure sensitive keys; a spacerlayer disposed proximal to the sensor substrate and having openings thatexpose the plurality of conductors of the plurality of pressuresensitive keys, respectively; and a flexible contact layer spaced apartfrom the sensor substrate by the spacer layer and configured to flexthrough the openings responsive to an applied pressure to contactrespective said conductors of the respective said keys, in whicharrangements of adhesive that secures the flexible contact layer to thespacer layer varies for first and second said pressure sensitive keys,one to another.
 29. An input device as described in claim 28, whereinthe arrangements define portions along edges of the first and secondpressure sensitive keys, respectively, that do not include adhesivethereby permitting greater flexibility of the flexible contact layer tocontact the sensor substrate at a location disposed proximal the portionof the edge that does not include the adhesive in comparison with aportion of the edge that does include the adhesive.
 30. An input deviceas described in claim 28, wherein the first said pressure sensitive keyis configured for inclusion as part of a home row of a keyboard and thesecond said pressure sensitive key is not included as part of the homerow of the keyboard.
 31. An input device as described in claim 28,wherein the arrangements are configured to address a likelihood ofmissed hits of the respective first and second said pressure sensitivekeys.
 32. An input device as described in claim 28, wherein an amount ofpressure applied the flexible contact layer that is usable to initiatean input for the first said pressure sensitive key is different than anamount of pressure applied to the flexible contact layer that is usableto initiate an input for the second said pressure sensitive key.
 33. Aninput device as described in claim 28, wherein flexibility of theflexible contact layer for the first said pressure sensitive key isdifferent than flexibility of the flexible contact layer for the secondsaid pressure sensitive key.
 34. An input device as described in claim28, wherein flexibility of the flexible contact layer along edges of thefirst said pressure sensitive key or the second said pressure sensitivekey is different, one to another, for the first pressure said sensitivekey or the second said pressure sensitive key.